To ensure high reliability of applications with flexible and soft PCBs and HDI, which have characteristics of less than 25 µm and flexible dielectrics of less than 25 µm. With the revolution in portable communications over the past decade, rigid flexible circuitry has become the preferred solution to meet the needs for complex three-dimensional product assembly and surface mounting of advanced parts.

two-way/one-way flexibility
multi-layer flexibility
multi-layer rigidity - flexibility
hybrid dielectric structure
fast rotation rigidity
HDI micro through hole - blind hole, buried hole, crisscrossing hole and embrasure
capsule with epoxy resin and copper gate
sequential construction
high-speed requirement
large chain