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XCVM1802-2MLEVFVC1760

XCVM1802-2MLEVFVC1760

Part Number
XCVM1802-2MLEVFVC1760
Manufacturer
Xilinx Inc.
Description
IC VERSAL AICORE FPGA 1760BGA
Data sheet
XCVM1802-2MLEVFVC1760.pdf
Category
Embedded - System On Chip (SoC)
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5000
Lead Time
To be Confirmed
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XCVM1802-2MLEVFVC1760

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  • Part Number # XCVM1802-2MLEVFVC1760 (Embedded - System On Chip (SoC)) is manufactured by Xilinx Inc. and distributed by Shenzhen Jinxinyang Technology Co., Ltd.. Being one of the leading electronics distributors, we carry many kinds of electronic components from some of the world’s top class manufacturers. Their quality is guaranteed by its stringent quality control to meet all required standards.For XCVM1802-2MLEVFVC1760 specifications/configurations, quotation, lead time, payment terms of further enquiries please have no hesitation to contact us. To process your RFQ, please add XCVM1802-2MLEVFVC1760 with quantity into BOM. Shenzhen Jinxinyang Technology Co., Ltd. does NOT require any registration to request a quote of XCVM1802-2MLEVFVC1760. Buy the XCVM1802-2MLEVFVC1760 Xilinx Inc. on Shenzhen Jinxinyang Technology Co., Ltd.,we are Xilinx Inc. Corporation distributor, we sales new&original and offer 24 hours service,90 days warranty date, send the XCVM1802-2MLEVFVC1760 within 24 hours,please contact our sales team or send email to liya@szjxy-ic.com Hope we can cooperate in the future.

    XCVM1802-2MLEVFVC1760 Specifications

    PackageTray
    SeriesVersal™ Prime
    RoHSRoHS
    Speed600MHz, 1.4GHz
    RAM Size256KB
    Flash Size-
    Part StatusActive
    PeripheralsDDR, DMA, PCIe
    ArchitectureMPU, FPGA
    ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Core ProcessorDual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
    Package / Case1760-BFBGA, FCBGA
    Primary AttributesVersal™ Prime FPGA, 1.9M Logic Cells
    Operating Temperature0°C ~ 100°C (TJ)
    Supplier Device Package1760-FCBGA (40x40)

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